Semiconductor Manufacturing / Inspection Equipment - Kanematsu PWS Ltd.

- Ultra -precision Die Bonder & Flip Chip Bonder

- Automated plating solution analyzer

- Automatic Defect Analysis System (ADAS) for photomask

<Custom Design/Manufacturing of Equipment>

 - Noncontact Wafer Thickness Gauge

 - Direct Metal Bonder for IGBT Module

 - Wafer Transfer System

 - Reticle Mask Stocker

- Wafer Edge Polisher

- OPUS3 Wafer Prober