Wafer Bonder - Kanematsu PWS Ltd.

The fully-automated Wafer Bonder XBS200 delivers high performance on the wafer of 200mm that requires high accuracy bonding. Its versatile modular system is designed to offer maximum process flexibility in all permanent bonding tasks. And its wafer transfer method has the novel unique features and promises the best process results.

SUSS MicroTec‘s XBS300 platform is fully-automated temporary bonding equipment. It supports the systems for all commercially available temporary bonding adhesives. In addition to various manufacturing methods currently in use, SUSS MicroTec is constantly focusing their efforts on supporting further materials and ready to offer the most choices for commercial adhesives.

The debonder and cleaner platform XBC300 Gen2 is designed for processing wafers of 200 and 300mm in size as well as carrier wafers. Moreover, intelligent process control enables handling of tape mounted device wafer as thin as 50µm or even below. Because of its advanced process versatility such as mechanical peel-off and excimer laser-assisted debonding / cleaning capabilities for thinned wafer and carrier wafer, XBC300 Gen2 offers a comprehensive solution for 2.5D and 3D integration applications.

XB8 wafer bonder is designed for a wide range of bonding processes and supports substrates with a wafer size of up to 200mm. All process parameters can be adapted flexibly according to the requirements, which makes the system perfect for use in research and development. In production, the high level of automation and the sophisticated design of XB8 ensure a high level of process stability. This makes XB8 wafer bonder ideal for applications of MEMS, advanced packaging, 3D integration and LED fields.

SB6/8 Gen2 is a semi-automated platform for multiple bonding processes and can be used for handling wafers up to 200mm as well as various shapes and types of substrates. For that reason, SB6/8 Gen2 presents itself as flexible tool for various applications and process environments. It is suitable for packaging as well patterning meeting the requirements for MEMS, LED, advanced packaging, 2,5D integration and 3D integration. SB6/8 Gen2 permits an easy switch from R&D to pilot production and finally high-volume manufacturing.

DB12 is a mechanical manual debonder at atmospheric temperature. It is designed to enable handling of various bonded wafers of up to 300mm.

ELD300 is debonding equipment using an excimer laser which uses 308nm laser pulses. For this reason, it can break the chemical bonds in a release layer and debond the adhesive without thermal stress.