Wafer Bonder
SUSS MicroTec’s wafer bonders combine more than sixty years of microstructuring experience with high consciousness for performance and solid product quality. Through partnership with research, academia and material suppliers, SUSS MicroTec develops intelligent bond solutions which offer leading-edge technology for the customers. Its wafer bonders cover many different applications in 2.5D and 3D integration, MEMS, LED and power devices as well as other areas of research and development.