Mask Aligner - Kanematsu PWS Ltd.

MA/BA Gen4 Pro series is designed by using the most versatile and the most extensible platform of all SUSS MicroTec's semi-automated mask aligners, and thus offers a wide range of application possibilities. It supports substrate sizes of up to 150ｘ150mm and 200ｘ200mm. Thanks to numerous tools and options, it sports an exceptional flexibility for many processes and can be used not only for research and development but also for production processes. Matured design concept and leading edge technology make MA/BA Gen4 Pro series the ideal platform to develop future technology. Thus it will establish the new industrial standards for MEMS, advanced packaging, 3D integration and compound semiconductor applications.

MA200 Gen3 mask aligner that is specifically designed for high volume production is suited for automated processing of square substrates and wafers up to 200mm. This system combines a variety of innovative features with full-field lithography technology. Therefore, it can be used not only for advanced packaging applications such as 3D packaging, fan-out, and bump packaging but also for MEMS production by thick resist, 3D patterning over wafer with gap, and compound semiconductors and image sensors.

MA100/150e Gen2 is a low-cost mask aligner supporting wafers of 2-6" in diameter. It is dedicated to MEMS and compound semiconductors (LED & LD) and can be also used to handle the thin fragile wafers and the largely warped wafers. Contact exposure mode enables the exposure with line-and-space pattern of 1.0um and supports gap exposure as well. In addition to surface alignment, back-side alignment and IR transmission alignment are optionally available.

Mask and bond aligner MA/BA6 designed for up to 150mm wafer size is the exposure/alignment equipment. MA/BA6 is optimally equipped for MEMS applications, production of optical components and compound semiconductors. Thanks to its high diversity, it sports the high level of performance in production environment as well as in the field of applications in research and development environment through process stability.

DSC300 Gen2 is a projection scanner using a leading edge projection lithography technology and can handle wafers up to 300mm. It is suited for applications such as wafer-level packaging, 3D packaging, and bump packaging. It also offers the ideal solutions in advanced packaging, especially Cu pillar bump and wafer-level chip-scale packaging. With its latest projection scanning technology, it is characterized by high performance optical system, accurate alignment, and high level of automation. Therefore, it also ensures excellent dimension uniformity (+/- 3%) in the wafer.

SUSS MicroTec’s ELP300 platform for wafer sizes between 200 and 300mm is based on the latest excimer laser stepper technology. Since this system supports dry etching processing using excimer laser (248/308nm) and mask, and laser abrasion functionality, it ensures an exceptional level of patterning precision and alignment.